The Plasma Science and Technology Division (PS) area will feature a spectrum of recent and exciting advances in plasma research, ranging from low pressure semiconductor related processing to atmospheric plasmas, from diagnostics for studying gas phase and surface processes to bioscience and nanotechnology applications. Papers are solicited in plasma etching and deposition of all materials, especially those used in advanced gate and interconnect fabrication and all kinds of electronic and optoelectronic device and chip manufacturing. Papers are solicited on plasma diagnostics, sensors, and modeling to understand and control a wide variety of plasmas including atmospheric and microplasmas and novel and established plasma sources. Papers are also solicited on the use of plasmas in nanotechnology, biosciences and deposition and surface treatment of polymers. Papers on plasma assisted growth of nanotubes, nanowires and other nanostructures and papers on fundamental understanding of their growth mechanisms are encouraged. Papers aimed at fundamental understanding of plasma-surface and plasma-wall interactions are also solicited. Papers on emerging plasma applications are encouraged.

PS1 Plasma Etching for Advanced Interconnects

 T. Nozawa, Tokyo Electron Ltd., Japan, "Challenges for Microwave Plasma Etching of Low-k Dielectrics"

PS2 Advanced Gate Etching

 T. Lill, Applied Materials Inc., "Plasma Etching in the Era of Intensive Integration Innovation"

PS3+MS  Lithography-Etch Interactions: Design for Manufacturing

 A. Neureuther, University of California, Berkeley, "Lateral Influence Functions and Test-Masks for Litho-Etch Interactions"

PS4+NS  Plasmas in Nanotechnology

 R. Hatakeyama, Tohoku University, Japan, "Ionic Plasmas Yielding Novel-Structured and -Functional Nanocarbons"

PS5 Plasma Surface Interactions

 J. Benedikt, Ruhr-Universität Bochum, Germany, "Growth Precursor Measurements and Study of Plasma Chemistry by Means of Mass Spectrometry"

 M. Gordon, California Institute of Technology, "New Insight into Fundamental Ion-Surface Interactions"

PS6 Plasma Enhanced Atomic Layer Deposition and Plasma Deposition

 H. Jeon, Hanyang University, South Korea, "Characteristics of HfO₂ Deposited by Remote Plasma ALD Method"

PS7 Plasma-Wall Interactions

 H. Singh, Lam Research Corporation, "Plasma-Wall Interactions in Inductively Coupled Plasma Reactor and Novel Method for Wall Condition Control"

PS8 Plasma Diagnostics, Sensors and Control

 T. Gans, Queen's University Belfast, Northern Ireland, "Electron Heating and Ionization Mechanisms in Dual-Frequency Capacitively Coupled Radio-Frequency Discharges"

 M. Sobolewski, National Institute of Standards and Technology, "Noninvasive Monitoring of Ion Current and Ion Energy during Plasma Processing"

PS9 Plasma Sources

 P. Chabert, École Polytechnique, France, "Electron Heating Mechanisms, Mode Transitions, and Non-Uniformities in Dual Frequency Capacitive Discharges"

PS10    Atmospheric and Micro Plasmas

 F. Massines, Laboratoire de Génie Electrique de Toulouse Université, France, "Silicon Based Coatings by Means of Glow and Townsend Dielectric Barrier Discharges"

PS11+BI  Plasmas in Bioscience

 I. Yamashita, Panasonic, Japan, "A New Bio Nano Process; The Combination of the Bio- and Inorganic-Material Composites and Plasma Technology"

PS12    Plasmas and Polymers

 E. Pargon, LTM/CNRS, France, "193 Resist Modifications during Plasma Processes and Impact on Patterning Technologies"

PS13    Plasma Processing for High k, III-V and Smart Materials

 S. Pearton, University of Florida, "Etching of SiC,GaN and ZnO for Wide Bandgap Semiconductor Device Applications"

PS14    Plasma Modeling

 T. Makabe, Keio University, Japan, "Vertically Integrated Computer Aided Design for Device"

PS15    Emerging Plasma Applications

PS16    Plasma Science and Technology Poster Session