The MEMS and NEMS Technical Group (MN) is organizing a program that highlights recent advances in the development of functional, integrated micro and nanoelectromechanical devices. This year’s session will cover areas that are thematically related to the materials processing and characterization, fabrication approaches, surface and interface sciences of MEMS and NEMS, and integration and packaging strategies of MEMS and NEMS. Applications of MEMS and NEMS devices in resonant sensing of chemical and biological immunospecific binding events, study of parametric dynamical phenomenon of coupled oscillator systems, electronics and dissipation mechanisms are also addressed. MEMS and NEMS will host three oral sessions as well as a joint session with the Tribology Program (TR). The program opens with a session focused on the impact of surfaces and interfaces on MEMS and NEMS device characteristics. The second session will cover integration and packaging issues of MEMS and NEMS devices. The final session covers materials processing, characterization and novel approaches to the fabrication of MEMS and NEMS.

TR+MN1  Surfaces and Interfaces in MEMS/NEMS

J. Krim, North Carolina State University

R. Maboudian, University of California, Berkeley

MN2+NM  Integration and Packaging in MEMS/NEMS

A. Lal, DARPA

MN3   Materials Processing, Characterization and Fabrication Aspects

P. McEuen, Cornell University

S. Pacheco, Freescale Semiconductor, Inc.

MN4   MEMS and NEMS Poster Session